The Subject of Reliability Evaluation for Hi Density Electronics Packaging
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: IEEJ Transactions on Fundamentals and Materials
سال: 1999
ISSN: 0385-4205,1347-5533
DOI: 10.1541/ieejfms1990.119.5_541